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DensTop EP 103
Epoxy filler compound
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DensTop EP 103 - two-component paste-like compound on epoxy base, specially developed for application in coating systems DensTop for the purpose of elimination defects and leveling surface by means of puttying.
✓Elimination minor defects (voids, pores);
✓Repair large defects (potholes, spalls, cracks);
✓Leveling surface after milling;
✓Puttying surface before application thin-layer coatings;
✓Installation coves and at, filling joints.
✓Allows fill pores and voids in substrate without their repeat appearance;
✓Is used as for puttying «on scratch coating», also and for repair large defects;
✓Eliminates processes associated with under ratio and preparation puttying compound from under material;
✓Use material with subsequent under allows preparation ideal substrate under thin-layer protection coating;
✓Does not contain solvents, odorless;
✓Absence shrinkage.
APPEARANCEViscous liquid
COLORGray
MIXING RATIO AND:B, BY BY WEIGHT100:15
DENSITY MIX AT 23°C, KG/M³1650±50
MASS FRACTION NONVOLATILE SUBSTANCES, %100
VISCOSITY MIX AT 23°C, METERSPA·S6750±1350
POT LIFE MIX AT 23°C, NOT LESS THAN, MIN30
DRYING TIME TO DEGREE 3, NOT MORE THAN, H10
SHORE HARDNESS D, 7 DAYS, CONDITIONS.UNITS74
BOND STRENGTH WITH CONCRETE SUBSTRATE, 7 DAYS, NOT LESS THAN, MPA3,5
MINIMUM / MAXIMUM INTERCOAT INTERVAL, H10 / 48
MINIMUM / MAXIMUM AIR TEMPERATURE AND SUBSTRATE DURING APPLICATION, °C+10 / +30
HUMIDITY SUBSTRATE DURING APPLICATION, NOT MORE THAN, %4
MAXIMUM HUMIDITY AIR DURING APPLICATION, NOT MORE THAN %80
TIME MIXING, MIN3
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